Partnership for Prototyping of CMOS+X Systems
Funding Agency:
- National Science Foundation
The National Science Foundation recognizes the opportunity to drive system-level performance improvements in computing and communications by integrating CMOS semiconductor chips with emerging technologies. Examples of promising emerging technologies include, but are not limited to, resistive and nanomagnetic memories and novel transistors based on ferroelectric or 2D materials. The promise of these emerging technologies has not been fully realized, in part because of barriers to collaboration between materials scientists who investigate novel materials and heterostructures, device researchers who model device characteristics, and computer system designers who create new circuits and architectures through simulation. Additionally, lack of access to fabrication facilities also poses a problem of co-integration of CMOS with emerging (X) technologies. Such barriers have been brought into focus by recent workshops exploring "CMOS+X" approaches funded by the National Science Foundation. See, for example, https://nsfedaworkshop.nd.edu/foundry-meeting/ and https://e3s-center.berkeley.edu/nsf-workshop-cmosx/cmos-x-report/.
Proposals in response to this DCL may be submitted to several programs:
- In the Directorate for Computer and Information Science and Engineering (CISE), proposals may be submitted to the the existing NSF/CISE core program solicitation (NSF 21-616) in the Small project category. Proposals may be submitted to the Foundations of Emerging Technologies cluster or the Software and Hardware Foundations cluster of the Division of Computing and Communication Foundations (CCF).
- In the Directorate for Mathematical and Physical Sciences, proposals may be submitted to the Electronic and Photonics Materials (PM) Program (NSF 21-600) of the Division of Materials Research (DMR).
- In the Directorate for Engineering, proposals may be submitted to the Electronics, Photonics and Magnetic Devices (EPMD) Program (PD 18-1517) or the Communications, Circuits, and Sensing Systems (CCSS) Program (PD 18-7564) of the Division of Electrical, Communications, and Cyber Systems (ECCS); or to the Advanced Manufacturing (AM) Program (PD 19-088Y) of the Division of Civil, Mechanical, and Manufacturing Innovation (CMMI).
Standard Grant
Various; Please see above for the RFP information.
Questions concerning this Dear Colleague Letter should be directed to program directors Sankar Basu or Pinaki Mazumder of CCF; Paul Lane of DMR; Rosa Lukaszew or Premjeet Chahal of ECCS; or Thomas Kuech of CMMI at: CMOSPlusX@nsf.gov.