Next-Generation Microelectronics Manufacturing (NGMM)
Funding Agency:
- Department of Defense
The NGMM program will establish a domestic center for R&D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems. The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation.
The Next-Generation Microelectronics Manufacturing (NGMM) program seeks to establish a holistic domestic capability for 3DHI R&D, developing key process modules for the design, packaging, assembly, and testing of 3DHI microsystems. If successful, the program will provide:
• an open-access manufacturing center to holistically address design, assembly, packaging, and testing;
• a pilot-line manufacturing capability;
• multi-project runs or dedicated taxi runs as a feature of the research service; and
• training and orientation for all users.
Multiple awards are anticipated. The amount of resources made available under this BAA will depend on the quality of the proposals received and the availability of funds.
5:00 PM, Eastern Time, 21 September 2022
BAA Coordinator HR001122S0050@darpa.mil