FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates
Funding Agency:
- Department of Commerce/EDA
This NOFO seeks applications for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. Through this NOFO, the NAPMP program seeks to achieve the following objectives:
(1) Accelerate domestic R&D and innovation in advanced packaging materials and substrates;
(2) Translate domestic materials and substrate innovation into U.S. manufacturing, such that these technologies are available to U.S. manufacturers and customers, including to significantly benefit U.S. economic and national security;
(3) Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and
(4) Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry.
NAPMP plans to release subsequent NOFOs relevant to other research areas and for an Advanced Packaging Piloting Facility (APPF), where successful development efforts will be transitioned and validated for scaled transition to U.S. manufacturing. The APPF is expected to be a key facility for technology transfer to high-volume manufacturing.
Webinar Information Session: The National Institute of Standards and Technology (NIST) CHIPS Research and Development Office (CHIPS R&D) will host an informational webinar on March 1, 2024, to provide general information regarding this NOFO, offer general guidance on preparing applications, and answer questions. Proprietary technical discussions about specific project ideas will not be permitted during the webinar, and CHIPS R&D staff will not critique or provide feedback on specific project ideas while they are being developed by an applicant, brought forth during the webinar, or at any time before the deadline for all applications. However, questions about the funding opportunity, eligibility requirements, evaluation and award criteria, selection process, and the general characteristics of a competitive application will be addressed at the webinar and by e-mail to research@chips.gov with “2024-NIST-CHIPS-NAPMP-01 Questions” in the subject line. There is no cost to attend the webinar, but participants must register in advance. Participation in the webinar is not required and will not be considered in the review and selection process.
Proposers Day and Teaming Meetings: In addition to the informational webinar described above, CHIPS R&D plans to host a proposers day March 12, 2024, to promote awareness of the funding opportunity and provide a forum for organizations to identify prospective partners. Information about the event can be found on the CHIPS for America events website.
Multiple awards
In FY24, CHIPS R&D anticipates making available approximately $300,000,000 for funding of multiple awards in amounts up to approximately $100,000,000 over up to 5 years per award, not including voluntary co-investment, though additional funding may be provided to applicants who address more than one technical area.
11:59 p.m. Eastern Time, July 3, 2024
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Programmatic and Technical Questions |
E-mail: research@chips.gov with “2024-NIST-CHIPS-NAPMP-01 Questions” in subject line |
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Technical Assistance with Grants.gov Submissions |
grants.gov Phone: 800-518-4726 E-mail: support@grants.gov |
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Award Management Inquiries |
Gilberto Castillo Phone: 202-281-8505 E-mail: gilberto.castillo@nist.gov with “2024-NIST-CHIPS-NAPMP-01 Questions” in subject line |